• Water washable, Pb-free solder paste
• Formulated so residues can be cleaned with deionized water
• Performance stability at 26.5°C for six months and at 40°C for one month.
• Humidity resistance: excellent coalescence after 24 hours exposure to 27°C/80% RH
• Excellent resistance to solder balling, initially and after exposure to humidity
• Suitable for fine pitch, high speed printing up to 150 mms-1 (6"/s)
• Excellent paste transfer efficiency after extended abandon times
• Excellent paste transfer efficiency after extended printing time
• Humidity resistance: Enhanced tack time
• Suitable for single and double side reflow

This temperature stability solder paste provides exceptional results in aqueous cleaning systems without the addition of saponifiers or co-solvents. Post-reflow residue removal is fast and easy, and the cleaning window has dramatically expanded, allowing manufacturers the flexibility to clean boards seven days after assembly. Stencil life and abandon times are superior to previous‑generation water wash formulas and storage stability is extended to provide game-changing, water-washable performance.
Room Temperature Stable to Eliminate Cold Storage