• Provides maximum thermal conductivity with superior dielectric properties
• Silicone free compound will not harden or dry out
• Electrically insulative; noncorrosive and nonflammable
• Thermally stable from -99.4°F/-73°C to 392°F/200°C
• Exceeds MIL-C-47113 for Thermal Conductivity

Formulated for maximum heat transfer between circuit components and heat sinks without electrical conductivity.