• Ribbon bonding wedge for gold and aluminum wire
• Slot Width: .0040" / 102 µm
• Bond Flat: .0030" / 76µm
• Bond Foot: .0030" / 76 µm
• Slot Thickness: .0020" / 51 µm
• Clearance 55° Slots: .0030" / 76 µm
• Tip Thickness 55°/60° Slots: .0120" / 305 µm
• Ribbon Width: .0020" / 51µm
• Max Ribbon size for a vertical shank (1/16) is .012” / 305µm ribbon

Special clearance for vertical hole shank using J Style is commonly used where deep access is required during bonding to the IC. The double relief allows for maximum clearance of the package while containing the wire in the vertical hole, keeping it from contacting the package walls. This prevents wire damage and wire drag which can cause poor looping performance. ( J Style is achieved by modifying the RW tool style.)