• Fast soldering on conventional leaded and SMD components - shiny joints; no bridges or icicles
• Sustained activity for maximum process window
• Resin-/rosin-free to give clean appearance to soldered PCB
• No cleaning - reduces costs and eliminates CFC usage
• Minimal residues to interfere with ATE probes without cleaning
• Compatible with rosin based surface preservatives
• Foam, spray or wave application

Multicore X33-08i is a resin free, no clean, halide free liquid flux for surfaces with poor solderability from the pioneers of “no clean” technology.