• Reflowable in air and nitrogen
• Residue easily removed with hot DI water (40C to 60C)
• Halogen-Free (no intentionally added halogens)
• Highly active and strong solderability performance
• Leaves bright shiny soldered joints after reflow
• ANSI/J-STD-004B flux anticipated ORHO

Kester TSF-8818HF is a water-soluble tacky soldering flux formula with a unique halogen-free activator system. TSF-8818HF is designed to have high tackiness to minimize component movement and misalignment during reflow, especially thin flip chip dice. TSF-8818HF is highly active even without halogens and can be used as a drop-in replacement for a variety of metallurgies including Sn-Pb eutectic and higher melting point lead-free alloys such as SnAg, SnCu, SnAgCu etc. Post-reflow residues are completely soluble in water and do not require cleaning additives.